US Patent Issued to NXP USA on Sept. 15 for "Power amplifier device having dies with elongated bondpads connected through a device substrate" (Arizona, Illinois Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,906, issued on Sept. 15, was assigned to NXP USA INC. (Austin, Texas).

"Power amplifier device having dies with elongated bondpads connected through a device substrate" was invented by Kevin Kim (Chandler, Ariz.), Vikas Shilimkar (Chandler, Ariz.) and Joseph Gerard Schultz (Wheaton, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power amplifier device includes first and second power transistor dies and a substrate. Each die includes an elongated bondpad and an integrated transistor with a terminal that is coupled to the elongated bondpad. The substrate is formed from a stack of multiple dielectric layers and multiple patterned conductive lay...