US Patent Issued to NXP USA on Sept. 15 for "Package on package semiconductor device with integrated antenna and method therefor" (Arizona, Texas Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,634, issued on Sept. 15, was assigned to NXP USA INC. (Austin, Texas).

"Package on package semiconductor device with integrated antenna and method therefor" was invented by Michael B. Vincent (Chandler, Ariz.) and Nikita Mahjabeen (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a package-on-package semiconductor device is provided. The method includes mounting an antenna sub-assembly on a first major side of a package substrate and a packaged RF semiconductor device on a second major side of the package substrate. The antenna sub-assembly includes an antenna substrate, an antenna substrate waveguide, and an antenna...