US Patent Issued to NXP USA on May 12 for "Double-sided multichip packages with direct die-to-die coupling" (Arizona Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,685, issued on May 12, was assigned to NXP USA INC. (Austin, Texas).

"Double-sided multichip packages with direct die-to-die coupling" was invented by Michael B. Vincent (Chandler, Ariz.), Scott M Hayes (Chandler, Ariz.) and Zhiwei Gong (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-chip package includes two electronic components bonded to each other via electrical contacts on corresponding faces of the components that are directly opposite each other. The components are encapsulated in a volume of molding material that includes a upper and lower sets of redistribution layers disposed on upper and lower surfaces of the volume...