US Patent Issued to NXP USA on March 24 for "Terminal interposers with mold flow channels, circuit modules including such terminal interposers, and associated methods" (Arizona Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,509, issued on March 24, was assigned to NXP USA INC. (Austin, Texas).

"Terminal interposers with mold flow channels, circuit modules including such terminal interposers, and associated methods" was invented by Eduard Jan Pabst (Mesa, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit module includes a module substrate, a terminal interposer, and encapsulant material. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The terminal interposer is coupled to the mounting surface of the module substrate. The terminal interposer includes a dielectric body and a conductive terminal. The die...