US Patent Issued to NXP USA on March 24 for "Multichip packages with 3D integration" (Dutch, American, Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,557, issued on March 24, was assigned to NXP USA INC. (Austin, Texas).

"Multichip packages with 3D integration" was invented by Zhiwei Gong (Chandler, Ariz.), Scott M Hayes (Chandler, Ariz.), Michael B. Vincent (Chandler, Ariz.), Leo van Gemert (Nijmegen, Netherlands), Antonius Hendrikus Jozef Kamphuis (Nijmegen, Netherlands) and Wen Hung Huang (Kaosiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package is formed that encapsulates first and second components having respective first and second thickness differing from each other. Each component has lower surface provided with electrical contact pads and an upper surface opposite the l...