ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,389, issued on July 28, was assigned to NXP USA INC. (Austin, Texas).
"Reusable modular substrate" was invented by Kabir Mirpuri (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device may include a substrate having a plurality of laminated layers and a plurality of electrical interconnect pads on an outer surface of the plurality of laminated layers. The substrate may include a first plurality of magnetic material deposits on the outer surface of the plurality of laminated layers. A device may mount to the substrate. The device includes an electronic component including a plurality of terminals, and a base including a plurality o...