ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,221, issued on Feb. 17, was assigned to NXP USA INC. (Austin, Texas).
"Molded packages with through-mold interconnects" was invented by Zhiwei Gong (Chandler, Ariz.), Lakshminarayan Viswanathan (Chandler, Ariz.) and Li Li (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Molded device packages which allow electrical contacts to coupled to a first surface of a circuit substrate such as a printed circuit board while allowing the opposite surface to remain exposed for other purposes such as bonding thermal structures such as heatsinks include electrically-conductive pillars which are bonded to the first surface of the substrate and enca...