ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,796, issued on Aug. 25, was assigned to NXP USA Inc. (Austin, Texas).
"Low stress packaging for environmental sensors" was invented by Chayathorn Saklang (Mesa, Ariz.), Stephen Ryan Hooper (Queen Creek, Ariz.) and Julien Juery (Tempe, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can inc...