US Patent Issued to NXP on March 24 for "Semiconductor device having dismantlable structure and method therefor" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,535, issued on March 24, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Semiconductor device having dismantlable structure and method therefor" was invented by Yu Ling Tsai (Kaohsiung City, Taiwan), Yao Jung Chang (Kaohsiung, Taiwan), Yen-Chih Lin (Hsinchu City, Taiwan), Tzu Ya Fang (Tainan City, Taiwan), Jian Nian Chen (Kosiiung City, Taiwan) and Yi-Hsuan Tsai (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device having dismantlable structure is provided. The method includes forming a packaged semiconductor die by mounting the semiconductor die onto a package substrate in a flip chip orientation, attaching a...