US Patent Issued to NVIDIA on Feb. 24 for "Thermocouple arrangement in thermal test vehicles to replicate lidless computing devices" (California Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,704, issued on Feb. 24, was assigned to NVIDIA Corp. (Santa Clara, Calif.).

"Thermocouple arrangement in thermal test vehicles to replicate lidless computing devices" was invented by Ali Heydari (Albany, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for testing in a datacenter are disclosed. In at least one embodiment, a thermocouple arrangement within a heat spreader of a thermal test vehicle (TTV) is provided to represent a lidless computing device to be commissioned based in part on heat flux feedback received from a thermocouple arrangement that includes at least two thermocouples at angles from different edges of a h...