US Patent Issued to NVIDIA on April 14 for "Reverse embedded power structure for graphical processing unit chips and system-on-chip device packages" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,721, issued on April 14, was assigned to NVIDIA Corp. (Santa Clara, Calif.).

"Reverse embedded power structure for graphical processing unit chips and system-on-chip device packages" was invented by Shawn Xiao (Santa Clara, Calif.), Justin Jiang (Santa Clara, Calif.), Henry Li (Santa Clara, Calif.), Jerry Zhou (Santa Clara, Calif.) and Joey Jiao (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die including a die body having a first body surface, a second body surface on an opposite side of the die body as the first body surface, an interconnect region adjacent to the first body surface including interconnect dielectric layers ...