US Patent Issued to NOVA MEASURING INSTRUMENTS on May 26 for "In-situ fingerprinting for electrochemical deposition and/or electrochemical etching" (German, Swiss Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,782, issued on May 26, was assigned to NOVA MEASURING INSTRUMENTS GMBH (Dresden, Germany).

"In-situ fingerprinting for electrochemical deposition and/or electrochemical etching" was invented by Juerg Stahl (Winterthur, Switzerland), Norbert Schroeder (Dresden, Germany) and Fred Richter (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range an...