US Patent Issued to Northwestern University on Sept. 29 for "Additive manufacturing of large-area covalent organic framework thin films" (Illinois Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,746,571, issued on Sept. 29, was assigned to Northwestern University (Evanston, Ill.).

"Additive manufacturing of large-area covalent organic framework thin films" was invented by Mark C. Hersam (Wilmette, Ill.), William R. Dichtel (Wilmette, Ill.), Nathan P. Bradshaw (Chicago) and Austin M. Evans (Evanston, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for preparing covalent organic framework (COF) thin films is disclosed herein. The systems and method utilize COF colloidal inks, having a diameter of 10-1000 nm, expelled through a nozzle onto a substrate to prepare the COF thin film. The plurality of COF colloidal ink droplet...