US Patent Issued to NITTO DENKO on Sept. 29 for "Electrical debonding adhesive sheet, joined body, and method for separating joined body" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,375, issued on Sept. 29, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Electrical debonding adhesive sheet, joined body, and method for separating joined body" was invented by Kaori Akamatsu (Ibaraki, Japan) and Mika Takashima (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical debonding adhesive sheet includes a substrate for voltage application having a conductive layer. The electrical debonding adhesive sheet also includes a first adhesive layer. The first adhesive layer includes an electrically debondable adhesive. The first adhesive layer is on the conductive layer of the substrate for voltage application. The e...