US Patent Issued to NITTO DENKO on March 17 for "Electrode having carbon layer with SP3/SP2 bonding" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,295, issued on March 17, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Electrode having carbon layer with SP3/SP2 bonding" was invented by Tomokazu Suetsugi (Ibaraki, Japan) and Motoki Haishi (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrode includes a substrate film, an inorganic oxide layer, a metal underlying layer, and an electrically conductive carbon layer in order toward one side in a thickness direction."

The patent was filed on July 20, 2021, under Application No. 18/017,389.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&S...