US Patent Issued to NITTO DENKO on June 30 for "Wiring circuit board and method of producing the wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,227, issued on June 30, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board and method of producing the wiring circuit board" was invented by Tomoaki Tanaka (Osaka, Japan), Hayato Takakura (Osaka, Japan) and Ryosuke Sasaoka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacen...