US Patent Issued to NITTO DENKO on June 16 for "Bonding method" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,333, issued on June 16, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Bonding method" was invented by Akiko Tanaka (Ibaraki, Japan), Yuto Suzuki (Ibaraki, Japan) and Chie Hamada (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickn...