US Patent Issued to NITTO DENKO on July 21 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,129, issued on July 21, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board" was invented by Hideki Matsui (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Ryosuke Sasaoka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the firs...