ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,214, issued on Feb. 17, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board" was invented by Kenta Fukushima (Osaka, Japan), Hayato Takakura (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Ryosuke Sasaoka (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pat...