US Patent Issued to NITTO DENKO on Aug. 25 for "Wiring circuit board and wiring circuit board assembly sheet" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,677, issued on Aug. 25, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Wiring circuit board and wiring circuit board assembly sheet" was invented by Kenya Takimoto (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Hayato Takakura (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thi...