ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,703, issued on April 7, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board" was invented by Shusaku Shibata (Osaka, Japan), Takahiro Ikeda (Osaka, Japan) and Teppei Niino (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. ...