ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,698, issued on April 7, was assigned to NITTO DENKO Corp. (Osaka, Japan).
"Wiring circuit board" was invented by Yusaku Tamaki (Osaka, Japan), Shusaku Shibata (Osaka, Japan) and Teppei Niino (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring circuit board includes a metal supporting substrate, an insulating layer, and a conductive layer in this order in a thickness direction. The conductive layer includes at least one terminal portion and a wiring portion extending from the terminal portion. The metal supporting substrate has an opening portion. The opening portion penetrates the metal supporting substrate in the thickness directi...