US Patent Issued to NITTO DENKO on April 21 for "Method for producing wiring circuit board and wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,459, issued on April 21, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Method for producing wiring circuit board and wiring circuit board" was invented by Kenya Takimoto (Osaka, Japan), Naoki Shibata (Osaka, Japan) and Hayato Takakura (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting subst...