US Patent Issued to Niterra Materials on Sept. 29 for "Tungsten wire, and tungsten wire processing method and electrolytic wire using the same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,749,591, issued on Sept. 29, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan).

"Tungsten wire, and tungsten wire processing method and electrolytic wire using the same" was invented by Hitoshi Aoyama (Yokohama, Japan), Hideaki Baba (Yokohama, Japan) and Kenji Tomokiyo (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. According to an EBSD analysis on a unit area, crystalline orientations having an orientation difference of 15 degrees or less from greater than101less than, which is parallel to a wire drawing direction, account for an area ...