US Patent Issued to Niterra Materials on June 23 for "Bonded body, ceramic circuit substrate, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,965, issued on June 23, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan).

"Bonded body, ceramic circuit substrate, and semiconductor device" was invented by Seiichi Suenaga (Yokohama, Japan), Maki Yonetsu (Mitaka, Japan), Sachiko Fujisawa (Kawasaki, Japan) and Yoichiro Mori (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the embodiment, a bonded body includes a ceramic substrate, a copper plate. A bonding layer is located on at least one surface of the ceramic substrate. The bonding layer bonds the ceramic substrate and the copper plate. The bonding layer includes a Ti reaction layer including titanium nitrid...