US Patent Issued to NITERRA MATERIALS on Feb. 24 for "Insulating circuit board and semiconductor device in which same is used" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,665, issued on Feb. 24, was assigned to NITERRA MATERIALS Co. LTD. (Yokohama, Japan).

"Insulating circuit board and semiconductor device in which same is used" was invented by Kazumitsu Morimoto (Yokohama Kanagawa, Japan) and Hideaki Hirabayashi (Yokohama Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment, a ceramic copper circuit board in which the reliability of bonding with a bonding layer is improved is provided, and an insulating circuit board includes an insulating substrate and a conductor part bonded to at least one surface of the insulating substrate. In XPS analysis of a nitrogen amount at the conduct...