US Patent Issued to Niterra Materials on April 21 for "Tungsten wire, tungsten wire processing method using the same, and electrolyzed wire" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,890, issued on April 21, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan).

"Tungsten wire, tungsten wire processing method using the same, and electrolyzed wire" was invented by Hitoshi Aoyama (Yokohama, Japan), Hideaki Baba (Yokohama, Japan) and Kenji Tomokiyo (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A tungsten wire according to an embodiment is a tungsten wire made of a W alloy containing rhenium, and includes a mixture on at least a part of a surface thereof, the mixture contains W, C, and O as constituent elements, and taking a radial cross-sectional thickness of the mixture as A mm and a diameter of the tungs...