ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,784, issued on Sept. 15, was assigned to NISSAN CHEMICAL Corp. (Tokyo).
"Laminate, release agent composition, and method for producing processed semiconductor substrate" was invented by Takahisa Okuno (Toyama, Japan), Takahiro Kishioka (Toyama, Japan) and Tetsuya Shinjo (Toyama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate that includes a semiconductor substrate; a support substrate that is light-transmissive; an adhesive layer; and a release layer provided between the semiconductor substrate and the support substrate, the laminate being used when the release layer absorbs light irradiated from a side of the support substrate and...