US Patent Issued to NIPPON ELECTRIC GLASS on May 12 for "Bonded body manufacturing method and bonded body" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,623,962, issued on May 12, was assigned to NIPPON ELECTRIC GLASS Co. LTD. (Shiga, Japan).

"Bonded body manufacturing method and bonded body" was invented by Toru Shiragami (Shiga, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a bonded body includes: a preparation step of interposing a sealing material (6) containing glass between a highly thermal conductive substrate (2) and a glass substrate (3); and a bonding step of forming a sealing layer (4) by irradiating the sealing material (6) with laser light (L). The bonding step includes: a first heating step of preheating the sealing material (6) at a temperature lower than a...