US Patent Issued to NIPPON ELECTRIC GLASS on Feb. 17 for "Glass for covering semiconductor element and material for covering semiconductor element using same" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,693, issued on Feb. 17, was assigned to NIPPON ELECTRIC GLASS Co. LTD. (Otsu, Japan).

"Glass for covering semiconductor element and material for covering semiconductor element using same" was invented by Masayuki Hirose (Otsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The glass for covering a semiconductor element contains: in mol %, as a glass composition, SiO2: 20% to 36%, ZnO: 8% to 40%, B2O3: 10% to 24%, Al2O3: 10% to 20%, and MgO+CaO: 8% to 22%, in which SiO2/ZnO is 0.6 or more and less than 3.3 in terms of a molar ratio, and a lead component is substantially not contained."

The patent was filed on Sept. 10, 2020, under Application ...