US Patent Issued to NIDEC on Oct. 27 for "Cooling device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,614, issued on Oct. 27, was assigned to NIDEC Corp. (Kyoto, Japan).

"Cooling device" was invented by Koji Hatanaka (Kyoto, Japan), Masataka Matsuoka (Kyoto, Japan) and Takehito Tamaoka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a cooling device, a main body is capable of being in thermal contact with a heat source and includes a flow path for refrigerant. A protruding portion protrudes from one surface of the main body to one side in a predetermined direction, and includes a hole extending from an end portion on the one side in the predetermined direction to the flow path. A joint is inserted into the hole, and includes a flow p...