US Patent Issued to NIDEC on May 26 for "Cooling unit" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,750, issued on May 26, was assigned to NIDEC Corp. (Kyoto, Japan).

"Cooling unit" was invented by Takaya Okuno (Kyoto, Japan) and Takahiro Imanishi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling assembly includes a first heat exchanger and a first flow path pipe. The first heat exchanger comes into contact with a first heat generating component. The first flow path pipe is connected to the first heat exchanger. The first flow path pipe includes a first intermediate portion between one end of the first flow path pipe connected to the first heat exchanger and the other end of the first flow path pipe. The first heat exchanger in...