US Patent Issued to NICHIA on Oct. 27 for "Wiring substrate, light-emitting device, and manufacturing methods thereof" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,759, issued on Oct. 27, was assigned to NICHIA Corp. (Anan, Japan).

"Wiring substrate, light-emitting device, and manufacturing methods thereof" was invented by Atsushi Hosokawa (Tokushima, Japan), Masaaki Katsumata (Anan, Japan) and Eiko Minato (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains sma...