US Patent Issued to NICHIA on May 19 for "Wiring substrate, light-emitting device, and manufacturing methods thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,325, issued on May 19, was assigned to NICHIA Corp. (Anan, Japan).

"Wiring substrate, light-emitting device, and manufacturing methods thereof" was invented by Atsushi Hosokawa (Tokushima, Japan) and Masaaki Katsumata (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes: a base body having an insulating property and including a first surface and a second surface on a side opposite the first surface; a resist portion covering at least part of the first surface and at least a part of the second surface of the base body and including a hole portion having a predetermined pattern; and a wiring line disposed in the hole ...