US Patent Issued to NICHIA on Feb. 24 for "Method of manufacturing metal structure for optical semiconductor device, package, and solution containing polyallylamine polymer" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,648, issued on Feb. 24, was assigned to NICHIA Corp. (Anan-shi, Japan).

"Method of manufacturing metal structure for optical semiconductor device, package, and solution containing polyallylamine polymer" was invented by Yasuo Kato (Anan, Japan) and Kazuya Matsuda (Anan, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a pl...