ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,023, issued on Aug. 11, was assigned to NICHIA Corp. (Anan, Japan).
"Method of manufacturing semiconductor element" was invented by Hirofumi Kawaguchi (Tokushima, Japan) and Takehiro Ishitani (Komatsushima, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film; forming a cover member disposed continuously on a portion of the first insulation film; forming a resist film on the cover member, and removing a portion of the cover member; removing a portion of the first insulation film and a por...