US Patent Issued to NGK INSULATORS on June 30 for "Bonded body and a method of producing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,388, issued on June 30, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).

"Bonded body and a method of producing the same" was invented by Takahiro Kawasaki (Tajimi-City, Japan) and Takuya Tomioka (Minamitsuru-District, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded body has a supporting substrate composed of silicon, a piezoelectric material substrate, and a bonding layer provided on a surface of the supporting substrate and composed of silicon oxide. The bonding layer has a refractive index of 1.468 or higher and 1.474 or lower."

The patent was filed on Oct. 24, 2022, under Application No. 18/048,951.

*For further information, ...