US Patent Issued to NGK INSULATORS on April 21 for "Composite material sintered body, joined assembly, semiconductor manufacturing apparatus member, and composite material sintered body manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,494, issued on April 21, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan).

"Composite material sintered body, joined assembly, semiconductor manufacturing apparatus member, and composite material sintered body manufacturing method" was invented by Kana Ibata (Nagoya, Japan), Asumi Nagai (Okazaki, Japan) and Katsuhiro Inoue (Ama-Gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite material sintered body includes silicon carbide, tungsten silicide, and tungsten carbide, contains 14.4 wt % or more and 48.6 wt % or less of silicon carbide, and has an open porosity of 1% or less."

The patent was filed on Feb. 12, 2024, under Applica...