US Patent Issued to NEPES LAWEH, NEPES HAYYIM on Nov. 3 for "Semiconductor package" (Philippine Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,865, issued on Nov. 3, was assigned to NEPES LAWEH Corp. (Cheongju-si, South Korea) and NEPES HAYYIM (Binan, Philippines).

"Semiconductor package" was invented by Jerry Lutiva Tan (Batangas, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one or more embodiments, a semiconductor package includes: a first semiconductor chip including an upper surface, a lower surface, and a side surface and including a chip pad provided on the upper surface; a first cover insulating layer covering the upper surface and the side surface of the first semiconductor chip; a first upper conductive layer extending along an upper surface of the first ...