US Patent Issued to NEO Semiconductor on Sept. 22 for "3D cell and array structures" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,744,086, issued on Sept. 22, was assigned to NEO Semiconductor Inc. (San Jose, Calif.).

"3D cell and array structures" was invented by Fu-Chang Hsu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various 3D cells, array structures, and processes are disclosed. In an embodiment, a memory cell array structure is provided that includes memory cells organized into rows and columns, input lines where each input line is connected to memory cells in a selected row, and the input lines form input line groups, and output lines where each output line is connected to memory cells in a selected column, and the output lines form output line groups....