US Patent Issued to nD-HI Technologies Lab on Aug. 4 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,009, issued on Aug. 4, was assigned to nD-HI Technologies Lab Inc. (Taipei City, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Ho-Ming Tong (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate module and a first processor. The substrate module includes a first substrate, a first voltage regulator component and a first grounded Faraday component. The first voltage regulator component is embedded in the first substrate and includes a plurality of surfaces. The first grounded Faraday component is embedded in the first substrate and covers one or more of the sur...