US Patent Issued to nD-HI Technologies Lab, ETRON TECHNOLOGY on July 28 for "Die package including a semiconductor die having a cavity within which a passive component is positioned, IC package and manufacturing process thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,803, issued on July 28, was assigned to nD-HI Technologies Lab Inc. (Taipei City, Taiwan) and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan).

"Die package including a semiconductor die having a cavity within which a passive component is positioned, IC package and manufacturing process thereof" was invented by Ho-Ming Tong (Taipei City, Taiwan) and Chao-Chun Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die package includes a semiconductor die, a passive component, a molding compound and a redistribution layer (RDL). The semiconductor die includes a first bonding pad. The passive component includes a second bonding pad. The molding co...