ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,712, issued on June 16, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan).

"Electrical connection and forming method thereof" was invented by Chih Chen (Hsinchu City, Taiwan) and Shih-Chi Yang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical connection includes a first driving substrate, a first adhesive layer, a first bonding pad a first bonding pad and a second bonding pad. The first driving substrate includes a first substrate and a first dielectric layer on the first substrate. The first adhesive layer is at a sidewall of the first dielectric layer of the first driving substrate. Th...