US Patent Issued to National University Corporation Hokkaido University on May 12 for "Oxide-containing copper fine particles, method for producing same, and method for producing sintered compact using oxide-containing copper fine particles" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,623,281, issued on May 12, was assigned to National University Corporation Hokkaido University (Sapporo, Japan).

"Oxide-containing copper fine particles, method for producing same, and method for producing sintered compact using oxide-containing copper fine particles" was invented by Tetsu Yonezawa (Sapporo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is oxide-containing copper fine particles including Cu64O and optionally Cu2O and coated with a carboxylic acid, wherein a mass ratio of Cu64O to a total mass of Cu, Cu64O and Cu2O is 0.5 to 2.0% by mass."

The patent was filed on Aug. 26, 2021, under Application No. 17/921,447.

*For fur...