ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,424, issued on March 31, was assigned to National TsingHua University (Hsinchu City, Taiwan).
"Heat dissipation device" was invented by Shwin-Chung Wong (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally couple...