US Patent Issued to NATIONAL CENTER FOR ADVANCED PACKAGING, SHANGHAI XIANFANG SEMICONDUCTOR on April 14 for "Chip packaging structure and preparation method therefor" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,730, issued on April 14, was assigned to NATIONAL CENTER FOR ADVANCED PACKAGING Co. LTD. (Wuxi, China) and SHANGHAI XIANFANG SEMICONDUCTOR Co. LTD. (Shanghai).

"Chip packaging structure and preparation method therefor" was invented by Quanlong Wang (Wuxi, China), Peng Sun (Wuxi, China) and Liqiang Cao (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided in the present application are a chip packaging structure and a preparation method therefor. The chip packaging structure comprises a substrate, a chip, an insulating layer, a capacitor structure and a packaging layer. According to the chip packaging structure and the packaging metho...