ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,742, issued on Oct. 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).
"Memory device package having scribe line and method for manufacturing the same" was invented by Wu-Der Yang (Taoyuan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device package and a method of manufacturing a memory device package. The memory device package includes a substrate having a first chip region, a second chip region, and a first scribe line region connected between the first chip region and the second chip region. The memory device package also includes a first memory chip disposed over the first chip region and a second memory ...