US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Package structure including heat sink structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,765, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Package structure including heat sink structure and method for manufacturing the same" was invented by Shing-Yih Shih (New Taipei City, Taiwan) and Tse-Yao Huang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a package structure and a method for manufacturing the package structure. The package structure includes an electronic device and a heat sink structure. The heat sink structure is disposed over the electronic device, and includes a base portion, a plurality of thermal vias and a thermally conductive...