ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,671, issued on March 17, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).
"Capacitor structure with two stacked conductive vias" was invented by Pin-Jhu Li (New Taipei City, Taiwan) and Shih-Fan Kuan (Taoyuan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A capacitor structure and a method of manufacturing a capacitor structure are provided. The capacitor structure includes a conductive via, an intermediate dielectric layer and a top electrode. The conductive via includes a neck portion located near a middle portion thereof. The intermediate dielectric layer is disposed on the conductive via. The top electrode is dispo...