US Patent Issued to NANYA TECHNOLOGY on July 21 for "Bonding pad structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,484, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Bonding pad structure and method for manufacturing the same" was invented by Wu-Der Yang (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding pad structure and a method of manufacturing a bonding pad structure are provided. The bonding pad structure includes a carrier, a first conductive layer disposed over the carrier, a second conductive layer disposed on the first conductive layer and contacting the first conductive layer, and a third conductive layer disposed on the second conductive layer and contacting the second conductive laye...